Lingfeng Gao

Ph.D. student (2022-present)

Research area:

● Topology optimization of non-linear, electromagnetic system.

Contact:

E-mail: lingfeng.gao{at}stonybrook.edu

Journal publications:

1. Lingfeng Gao, Xiaoping Zhu, Masato Tanaka, Yuyang Song, Yuqing Zhou, Xianfeng David Gu, Shikui Chen*, “Geometry-Driven Design of Morphable Surface Structures Using Topology Optimization and Circle Packing”, Journal of Mechanical Design.

2. Lingfeng Gao, David Torrey, Fang Luo, Jon Longtin, Shikui Chen*, “Multi-Material Topology and Magnetization Co-Optimization of Circular Halbach Arrays via a Cardinal Basis Function (CBF) Based Level Set Method”, Journal of Mechanical Design. (under review)

 

Conference publications:

1. Lingfeng Gao, David Torrey, Jon Longtin, Fang Luo, Shikui Chen*, “Shape and Topology Optimization of Circular Halbach Array Using a Cardinal Basis Function (CBF) Based Parametric Level Set Method ”, the ASME 2025 International Design Engineering Technical Conferences &  Computers and Information in Engineering Conference (IDETC/CIE 2025), August 17-20, 2025, Anaheim, CA, USA.

2. Lingfeng Gao, Xiaoping Zhu, Masato Tanaka, Yuyang Song, Yuqing Zhou, Xianfeng David Gu, Shikui Chen*, “Geometry-Driven Design of Morphable Surface Structures Using Topology Optimization and Circle Packing”, the ASME 2024 International Design Engineering Technical Conferences &  Computers and Information in Engineering Conference (IDETC/CIE 2024), August 25-28, 2024, Washington, DC, USA.

3. Xiaoqiang Xu, Abdul Basit Mirza, Lingfeng Gao, Fang Luo, Shikui Chen*. “ Topology Optimization of Heat Sink for 3D Integrated Power Converters.” ASME Proceedings of InterPACK, October 25-27, 2022, Garden Grove, California, USA.

 

Patents:

1. Systems and methods for forming multiple 3d structures from a circularly-packed network of structural elements. patent number 12,467,274.

2. SURFACE MORPHING TECHNOLOGY USING AN INTERCONNECTED NETWORK OF CIRCULAR COMPLIANT ACTUATORS. Technology ID: 050-9477